D&L  has strong relationships with EMS suppliers who offer high-volume, low-cost assembly services and quick-turn full service prototypes who are ISO9001, AS9100 and ITAR certified.  OEM’s seeking those services are invited to contact D&L.

Circuits West — PCB Fabrication

Quick-turn PCBs. Quality coupled with quick, reliable delivery at competitive prices. 95% of orders delivered in 10 days 33% delivered in 3 days. RFQ’s answered in 90 minutes or less.


  • From 1- 20 Layers
  • Blind & Buried Vias / Via in Pad Technology
  • Automated Optical Inspection (AOI)
  • Controlled impedance
  • Plated Slots / Plated Edges / Selective Plating
  • Planar Transformers / Printed Antennas
  • .003” (76um) Trace/Space
  • .006″ (152um) Hole size
  • Finish: Tin plating  / 63/37 Solder / ENIG / Immersion Silver / Hard Gold / Soft Gold
  • Lead Free Solder

Circuits West Website

PFC Flex Circuits — Flex Circuit Fabricaion and Assembly / Prototype and Production

Flex Circuit Design, Design Analysis, Fabrication and Assembly from single layer to 16 layers, including rigid-flex designs, multi layer, rigid flex and sculptured flex for exposed contact fingers.

  • Combined 100 years of Design and manufacturing experience
  • Deep Analysis of flex layout
  • Ships Millions of flex circuits per year 99.99% Quality score
  • Will provide assembly


  • ISO 9001-2008
  • ISO 13485-2003 (Medical Device)
  • ITAR registered US Military

Manufacturing Processes adhere to

  • IPC 6013 flexible circuit manufacturing standards
  • IPC-A-600/610 Assembly inspection.
  • IPC-6013 Qualification and Performance specification
  • IPC-2223 Sectional Design for flexible printed circuit boards
  • IPC-A-600 Acceptability of Printed Circuit Boards
  • IPC-A-610 Acceptability of Electronic Assemblies
  • IPC-4101 Rigid Materials – Materials for rigid and multilayer printed circuit boards
  • IPC-4203 Cover Lays – Adhesive coated dielectric films for use as cover sheets
  • IPC-4204 Metal Clad Flexible Dielectrics
  • IPC-SM-840 Solder Mask qualification and performance requirements
  • IPC-4552 Specification for Electroless Nickel/Immersion Gold plating (ENIG)
  • IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards
  • J-STD 006 HASL plating thickness spec Post-process and Output (Hot Air Solder Leveling)
  • ASTM B 488 Standard Specification for Electrodeposited Coatings of Gold

PFC Website